CN CN107526027B

A rapid diagnosis method for PCBA board BGA chip solder joint problems

Publication no.

CN107526027B
Priority date
2017-09-04
Filing date
2017-09-04
Published
2019-08-20
Granted
2019-08-20
Assignee
中国航空工业集团公司洛阳电光设备研究所
Inventor

段知晓

Abstract

Step 7: For the output pin solder joints of BGA devices, use the boundary scan controller to send excitation and oscilloscope sampling to design test scripts; for the input pin solder joints of BGA devices, use the signal generator to send excitation, boundary Design the test script by scanning the …

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