EP EP4797322A1
[0001] The invention provides a cleaning apparatus (100) for cleaning a carrier (200) for semiconductor fabrication articles, particularly wafers, wherein the apparatus (100) comprises a degassing chamber (110) configured to accommodate at least one carrier (110), a heat source (120) provided within the degassing chamber (110), a protective frame (130) arranged at least partially around the heat source (120), such that the heat source (120) is prevented from physically contacting a carrier (200) placed into the degassing chamber (110), an evacuator (160), configured to withdraw gas from the degassing chamber (110) and to provide and/or maintain a vacuum pressure, which is lower than a predefined pressure threshold, within the degassing chamber (110), and a purge gas supply (140) configured to provide a purge gas (503) into the protective frame (130). Further, a method (500) for cleaning a carrier (200), particularly by operating such an apparatus (100), is provided.
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