CN CN108709335B
The invention discloses a semiconductor refrigeration device, comprising a heat conduction inner tank, a semiconductor refrigeration module and a humidity control assembly. The semiconductor refrigeration module includes a first semiconductor refrigeration chip, a heat pipe and an assembly module. The assembly module includes a first heat insulation bracket, a second heat insulation Two heat-insulating brackets, a hot-end heat-conducting seat and a cold-end heat-conducting seat, the first heat-insulating support is provided with a first groove, the first groove is provided with a mounting hole penetrating the first heat-insulating support, and the second heat-insulating support A second groove is provided, the first heat insulation support is fixed on the second heat insulation support, an installation cavity is formed between the first groove and the second groove, the first semiconductor refrigeration chip is located in the installation hole, and the cold end conducts heat The seat is in contact with the cold end surface of the first semiconductor refrigeration chip, the hot end heat conduction seat is in contact with the hot end surface of the first semiconductor refrigeration chip, and the heat pipe is connected to the cold end heat conduction seat. Realize the reduction of the cooling loss of the semiconductor refrigeration module, so as to improve the refrigeration efficiency of the refrigeration equipment and reduce the energy consumption.
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